Thin Film Process Equipment

Metriflow Solutions provides a comprehensive line of thin-film process systems engineered for semiconductors, optics, and advanced material manufacturing. Our product range covers physical vapor deposition (PVD), chemical vapor deposition (CVD), and continuous roll-to-roll coating platforms — delivering precision control of film thickness, composition, and uniformity for both R&D and industrial-scale production.

Built in collaboration with China’s leading vacuum technology companies, these systems feature robust chamber design, intelligent plasma control, and modular process configurations, supporting multi-material coatings with exceptional reproducibility and efficiency.

Product Line Overview

1. Monomer Coating Equipment

Compact, versatile PVD systems for decorative, optical, or functional coatings.

• Coating types: Ti/Cr/Al-based nano-composite films

• Heating temperature: 500–550 °C

• Integrated GISETCH® gas ion-etching and Smart Shutter system
  Applications: optical lenses, protective films, and decorative finishes.

2. Continuous Coating Equipment

High-efficiency systems for large-area substrates and continuous coating processes.

• Substrate width: up to 2500 mm

• Film uniformity: ≤ ±5%

• Substrate speed: 30–1000 mm/min

• Supports sputtering, arc, and evaporation sources
  Applications: solar panels, reflective coatings, and functional metal sheets.

3. Magnetron Sputtering Winding Coating System

Roll-to-roll PVD sputtering system for ultra-thin flexible substrates.

• Substrate width: up to 2000 mm

• Coiling speed: 0.1–1000 m/min

• Cathode types: flat or rotating

• Drum temperature: –20 to 80 °C
  Applications: flexible electronics, polymer films, and conductive foils.

4. Wire-Feeding Evaporation Winding Coating System

Advanced evaporation platform using metal wire feed sources for stable film growth.

• Evaporation boat source

• Ion-source pretreatment and heating stages

• Suitable for polymer or metallic foil substrates
  Applications: conductive, reflective, and barrier coatings.

5. Electron-Beam Evaporation Winding Coating System

High-precision system using electron-beam evaporation for dense multilayer coatings.

• Modular multi-cathode configuration

• Real-time beam power and deposition rate control
  Applications: high-reflectivity mirrors, optical films, and laser protection layers.

6. Chemical Vapor Deposition (CVD) Equipment

High-performance CVD systems for semiconductor and ceramic thin film fabrication.

• Temperature: 600–1800 °C

• Vacuum: ≤ 5 Pa

• Process pressure: 100–20,000 Pa

• Uniform gas distribution with multi-zone heating
  Applications: dielectric coatings, barrier films, and ALD-style layer growth.

Highlights

• Film uniformity ≤ ±5% over large substrates

• Temperature range: –20 to 1800 °C

• Multi-zone plasma and bias control

• Supports sputtering, arc, and evaporation modes

• Continuous or batch operation configuration

• Smart interface for process monitoring and diagnostics

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